知识与资讯
专业词汇
 
线路板流程术语中英文对照
发布时间:2011-7-17 11:45:00||  点击:1899次||  文章分类:专业词汇||  发布人:翻译家(Fanyijia.com)


流程简介:开料--钻孔--干膜制程--压合--减铜--电镀--塞孔--防焊(绿漆/绿油)
  
   --镀金--喷锡--成型--开短路测试--终检--雷射钻孔
  
  A. 开料( Cut Lamination)
  
  a-1 裁板( Sheets Cutting)
  
  a-2 原物料发料(Panel)(Shear material to Size)
  
  B. 钻孔(Drilling)
  
  b-1 内钻(Inner Layer Drilling )
  
  b-2 一次孔(Outer Layer Drilling )
  
  b-3 二次孔(2nd Drilling)
  
  b-4 雷射钻孔(Laser Drilling )(Laser Ablation )
  
  b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)
  
  C. 干膜制程( Photo Process(D/F))
  
  c-1 前处理(Pretreatment)
  
  c-2 压膜(Dry Film Lamination)
  
  c-3 曝光(Exposure)
  
  c-4 显影(Developing)
  
  c-5 蚀铜(Etching)
  
  c-6 去膜(Stripping)
  
  c-7 初检( Touch-up)
  
  c-8 化学前处理,化学研磨( Chemical Milling )
  
  c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)
  
  c-10 显影(Developing )
  
  c-11 去膜(Stripping )
  
  Developing , Etching & Stripping ( DES )
  
  D. 压合Lamination
  
  d-1 黑化(Black Oxide Treatment)
  
  d-2 微蚀(Microetching)
  
  d-3 铆钉组合(eyelet )
  
  d-4 叠板(Lay up)
  
  d-5 压合(Lamination)
  
  d-6 后处理(Post Treatment)
  
  d-7 黑氧化( Black Oxide Removal )
  
  d-8 铣靶(spot face)
  
  d-9 去溢胶(resin flush removal)
  
  E. 减铜(Copper Reduction)
  
  e-1 薄化铜(Copper Reduction)
  
  F. 电镀(Horizontal Electrolytic Plating)
  
  f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)
  
  f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)
  
  f-3 低于1 mil ( Less than 1 mil Thickness )
  
  f-4 高于1 mil ( More than 1 mil Thickness)
  
  f-5 砂带研磨(Belt Sanding)
  
  f-6 剥锡铅( Tin-Lead Stripping)
  
  f-7 微切片( Microsection)
  
  G. 塞孔(Plug Hole)
  
  g-1 印刷( Ink Print )
  
  g-2 预烤(Precure)
  
  g-3 表面刷磨(Scrub)
  
  g-4 后烘烤(Postcure)
  
  H. 防焊(绿漆/绿油): (Solder Mask)
  
  h-1 C面印刷(Printing Top Side)
  
  h-2 S面印刷(Printing Bottom Side)
  
  h-3 静电喷涂(Spray Coating)
  
  h-4 前处理(Pretreatment)
  
  h-5 预烤(Precure)
  
  h-6 曝光(Exposure)
  
  h-7 显影(Develop)
  
  h-8 后烘烤(Postcure)
  
  h-9 UV烘烤(UV Cure)
  
  h-10 文字印刷( Printing of Legend )
  
  h-11 喷砂( Pumice)(Wet Blasting)
  
  h-12 印可剥离防焊(Peelable Solder Mask)
  
  I . 镀金Gold plating
  
  i-1 金手指镀镍金( Gold Finger )
  
  i-2 电镀软金(Soft Ni/Au Plating)
  
  i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)
  
  J. 喷锡(Hot Air Solder Leveling)
  
  j-1 水平喷锡(Horizontal Hot Air Solder Leveling)
  
  j-2 垂直喷锡( Vertical Hot Air Solder Leveling)
  
  j-3 超级焊锡(Super Solder )
  
  j-4. 印焊锡突点(Solder Bump)
  
  K. 成型(Profile)(Form)
  
  k-1 捞型(N/C Routing ) (Milling)
  
  k-2 模具冲(Punch)
  
  k-3 板面清洗烘烤(Cleaning & Backing)
  
  k-4 V型槽( V-Cut)(V-Scoring)
  
  k-5 金手指斜边( Beveling of G/F)
  
  L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing)
  
  l-1 AOI 光学检查( AOI Inspection)
  
  l-2 VRS 目检(Verified & Repaired)
  
  l-3 泛用型治具测试(Universal Tester)
  
  l-4 专用治具测试(Dedicated Tester)
  
  l-5 飞针测试(Flying Probe)
  
  M. 终检( Final Visual Inspection)
  
  m-1 压板翘( Warpage Remove)
  
  m-2 X-OUT 印刷(X-Out Marking)
  
  m-3 包装及出货(Packing & shipping)
  
  m-4 目检( Visual Inspection)
  
  m-5 清洗及烘烤( Final Clean & Baking)
  
  m-6 护铜剂(ENTEK Cu-106A)(OSP)
  
  m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)
  
  m-8 冷热冲击试验(Thermal cycling Testing)
  
  m-9 焊锡性试验( Solderability Testing )
  
  N. 雷射钻孔(Laser Ablation)
  
  N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)
  
  N-2 雷射曝光对位孔(Laser Ablation Registration Hole)
  
  N-3 雷射Mask制作(Laser Mask)
  
  N-4 雷射钻孔(Laser Ablation)
  
  N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)
  
  N-6 Blaser AOI (after Desmear and Microetching)
  
  N-7 除胶渣(Desmear)
  
  N-8 微蚀(Microetching )

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